Tekmos Talks

 
A Newsletter for the Semiconductor Industry
July 2017 
 

 Tekmos 20th Anniversary

Welcome to Tekmos Talks July 2017. In this issue of Tekmos Talks, we are going to talk about RISC-V, our upcoming visit to the International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2017) Queen's College, our recent trip to Space Expo 2017, and feature a high temperature chip product.

Be sure to check out Tekmos technical services: Design and Verification, Test and Characterization, and Burn-in and Reliability.

From the Desk of the President

RISC-V R & D

Tekmos serves several high reliability markets, such as aerospace, military, and oil. It is therefore only natural that much of our internal R&D efforts are directed toward increasing the reliability of our products. One of these efforts is aimed at improving the reliability of processors. One way to do so is using a triple redundancy for all flops in the processor, a technique called RHBD (Rad-Hard By Design). This works, but is a brute force approach that at a minimum, triples the circuit size. We have another approach that may only add a 30% overhead.

To verify this approach, we need a processor to try it out on. There are many processors out in the market, but they come with licensing fees and restrictions on changes to the internal architecture. And we need to modify the internal architectures.

So, we chose the RISC V processor, which is an open source processor from Berkley. An interesting aspect of this processor is that it is defined by the instruction set, rather than the hardware. The RISC V processor is finding increasing acceptance, and is supported by several development tools.

Our first step was to get the basic design up and running in our simulator. Then came the more difficult task to fully understand the design. This is where we are now. Next, we use the RISC V as a test bed to prove out our reliability concepts. What is next beyond that is a little uncertain, and is more of a marketing decision. Check back with us in a year and see how it turns out.

Contact us today at This email address is being protected from spambots. You need JavaScript enabled to view it. for more information.

Tekmos Upcoming Events

HiTEN 2017

Tekmos will be returning to the United Kingdom as a sponsor for the International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2017 ) Queen's College, Cambridge July 10-12.

Queens' College is a constituent college of the University of Cambridge, England and one of the oldest and largest colleges of the university, founded in 1448 by Margaret of Anjou (the queen of Henry VI, who founded King's College). One must not confuse it with Queen's College, Oxford founded in 1341.

Visiting engineers to the conference should be intrigued by the Mathematical Bridge located on campus, officially known as the Wooden Footbridge. It was designed by William Etheridge a carpenter from a long line of such, and built by James Essex the Younger. The bridge is 50 feet 8 inches (15·44 metres) long. The angle between two adjacent radials (except the ones on the abutments) is one 32nd of a revolution. The arch is composed of tangents to a circle of radius 32 feet. The arrangement of timbers is a series of tangents that describe the arc of the bridge, with radial members to tie the tangents together and triangulate the structure, making it rigid and self-supporting. This type of structure, technically tangent and radial trussing, is an efficient structural use of timber, and was also used for the timber supporting arches (centering) used for building stone bridges. Analysis of the design shows that the tangent members are almost entirely under compression, while the radial timbers are almost entirely subject to tension with very little bending stress, or to put it another way, the tangent and radial elements elegantly express the forces involved in arched construction.

 bridge

Product Feature

TK89H51B

The TK89H51B family is based on the 8051 architecture, is designed to work in high temperature environments up to 210ºC. There are three versions, defined by package size. The "A" version has full functionality while the lower pin count "B" and "C" versions containing a subset of the functions.

The "A" version of the TK89H51B provides a non-multiplexed address and data bus, the 8-bit ADC, three additional parallel ports, and the SPI port. The "A" version also supports ISP, allowing for the downloading of programs into an existing system using HEX records. After the user program has been received, the processor jumps to location 0000 for further operation.

The TK89H51B family is made on a 0.6u bulk silicon technology process which has a long and successful history.

The TK80H51B family contains seven 8-bit bidirectional parallel ports, two external interrupt sources, three timer/counters, a serial port with a hardware interrupt capability and a frame error detect flag, power management, a programmable counter array (PCA), an 8-bit, 8-channel ADC, and a SPI port. These peripherals are supported by a multiple source, four level interrupt capability. The core processor contains 256 bytes of scratchpad RAM and another 256 bits of XRAM that can be used as program storage.

We have been using a "H" designator for the 8051 series to indicate high temperature. But now that we have both bulk and SOI parts underway, we find it necessary to create new part numbers. In the past, other 8051 vendors have differentiated their parts with a suffix, and so we followed that procedure. Here is our numbering system for the 0.6u, high temperature 8051s:

Device Package Description
TK89H51BA 68 Pin PGA With additional ports and ADC
TK89H51BB 48 Pin DIP With ADC
TK89H51BC 40 Pin DIP Original 8051 footprint

 

Request for Product Information

To request information click here TK89H51B

Inside Tekmos Visit to Space Expo

Space Tech Expo 2017 Show

Tekmos attended the Space Tech Expo 2017 in Pasadena in late May.

robotThe Space Tech Conference offered an agenda that helped commercial, military, government and academic organizations navigate the opportunities and challenges of doing business in an increasingly complex landscape.

The conference examined questions and issues including:

  • Implementing 'Space Enterprise Vision' - adapting a new era in Air Force space requirements
  • New space and old space - how will incumbents and start up's work together co-operating instead of competing?
  • Commercial, government and military collaboration in future space
  • Space funding and new space finance
  • How do you accelerate from being a start up to a real market player?
  • Improving US commercial space competitiveness - increasing space exports
  • Small launch vehicles - addressing the bottleneck of getting into space
  • Space traffic management/ space situational awareness - managing congested space and assuring safety
  • Scaling operations and manufacturing capabilities to support growth of mega constellations

 

Contact This email address is being protected from spambots. You need JavaScript enabled to view it. if you would like to discuss radar or other applications for Contact devices.

Thank You for Reading Tekmos Talks

Thank you for reading Tekmos Talks and helping us celebrate 20 years. Call (512) 342-9871 or email Sales for more information.

Tekmos, 20 years of solutions.

Sincerely,

Lynn Reed, President

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7901 E. Riverside Dr. Building 2, Suite 150
Austin, TX 78744
Phone: (512) 342-9871
Fax: (512) 342-9873
Email: This email address is being protected from spambots. You need JavaScript enabled to view it.
Source: Tekmos, Inc.

 
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