Tekmos 80C51 Microcontrollers Cross References

The TK80C51FA contains a superset of previous 8051 architectures. As a result, it may be used to replace many earlier devices. The following table provides a cross reference to Intel 8051s.

80C31BH Family

80C32 Family

80C51 Family

Notes:

1. Tekmos part is not burned-in. Burn-in services are available. Contact Factory.
2. PDIP package replacing CERDIP package.
3. Contact Factory for specification matching.
4. Tekmos parts have a maximum speed of 20 MHz with 6X clock.

The TK80C51FA contains a superset of previous 8051 architectures. As a result, it may be used to replace many earlier devices. The following table provides a cross reference to NXP 8051s.

80C31 Family

80C32 Family

80C32X2 Family

80C51FA Family

Notes:

1. Contact Factory for specification matching.
2. Tekmos parts have a maximum speed of 20 MHz with 6X clock.

Intel 80C186EB and 80C188EB Device Types

NXP 83C751 Device Types

NXP 87C751 Device Types

NXP 89C668 Device Types

General Description

Tekmos manufactures replacements for the popular 68HC11 series of microcontrollers. We cover the A, D, E, F, and K series. Within each series, we provide ROMless and Flash versions. These replacements are functional replacements for the original parts. However, there are some differences, particularly in the packaging options.

Packaging – RoHS

All parts from Tekmos are RoHS compatible. This is equivalent to the “E” suffix in the original series.

Speed Grades

The original series offered parts whose maximum speed ranged from 1 MHz to 3 or 4 MHz. The Tekmos parts are manufactured on a much newer technology, and all Tekmos parts work at the maximum speed.

Temperature Grades

The Tekmos parts are designed to operate over the “M” grade, and can be tested to insure compliance. This may involve a longer leadtime.

Tape and Reel

The R suffix is used to indicate Tape & Reel packaging. Otherwise, PLCC and PDIP devices are shipped in plastic tubes, and LQFP devices are shipped in JEDEC trays.

68HC711 Series

Tekmos parts use Flash instead of the OTP EPROM that was used in the original series. The Tekmos parts are reprogrammable, but require a different programming algorithm.

Significant Package Differences

Packaging – FN-52 (PLCC-52)

The 52 pin PLCC package is obsolete. Tekmos offers two alternatives.

First, we offer the same parts in a 52 pin LQFP package, which is the “PB” package in the original series. The LQFP footprint fits within the original PLCC footprint for easy board modification.

Tekmos also offers an adapter card that holds the 52 pin LQFP package and will mount on a 52 pin PLCC footprint.

Packaging – FU-64 and FU-80

These packages are also obsolete. Tekmos offers product in a LQFP package that is physically the same size, but whose leads do not extend as far from the package (footprint). This package is referred to with the code “PU”

The FU package has leads that extend a nominal 1.3 mm from the side (2.6 mm footprint). The Tekmos part has leads that extend a nominal 1.0 mm from the side (2.0 mm footprint).

The FU package is 14 x 14 x 2.2 mm. The Tekmos package “PU” is 14 x 14 x 1.4 mm.

TK68HC11 D Series

Notes:

1. Uses “PB” Package in place of “FB” package.

2. Packages are RoHS.

3. 3 MHz speed grade replaces 2 MHz speed grade

General Description

Tekmos manufactures replacements for the popular 68HC11 series of microcontrollers. We cover the A, D, E, F, and K series. Within each series, we provide ROMless and Flash versions. These replacements are functional replacements for the original parts. However, there are some differences, particularly in the packaging options.

Packaging – RoHS

All parts from Tekmos are RoHS compatible. This is equivalent to the “E” suffix in the original series.

Speed Grades

The original series offered parts whose maximum speed ranged from 1 MHz to 3 or 4 MHz. The Tekmos parts are manufactured on a much newer technology, and all Tekmos parts work at the maximum speed.

Temperature Grades

The Tekmos parts are designed to operate over the “M” grade, and can be tested to insure compliance. This may involve a longer leadtime.

Tape and Reel

The R suffix is used to indicate Tape & Reel packaging. Otherwise, PLCC and PDIP devices are shipped in plastic tubes, and LQFP devices are shipped in JEDEC trays.

68HC711 Series

Tekmos parts use Flash instead of the OTP EPROM that was used in the original series. The Tekmos parts are reprogrammable, but require a different programming algorithm.

Significant Package Differences

Packaging – FN-52 (PLCC-52)

The 52 pin PLCC package is obsolete. Tekmos offers two alternatives.

First, we offer the same parts in a 52 pin LQFP package, which is the “PB” package in the original series. The LQFP footprint fits within the original PLCC footprint for easy board modification.

Tekmos also offers an adapter card that holds the 52 pin LQFP package and will mount on a 52 pin PLCC footprint.

Packaging – FU-64 and FU-80

These packages are also obsolete. Tekmos offers product in a LQFP package that is physically the same size, but whose leads do not extend as far from the package (footprint). This package is referred to with the code “PU”

The FU package has leads that extend a nominal 1.3 mm from the side (2.6 mm footprint). The Tekmos part has leads that extend a nominal 1.0 mm from the side (2.0 mm footprint).

The FU package is 14 x 14 x 2.2 mm. The Tekmos package “PU” is 14 x 14 x 1.4 mm.

TK68HC11 E Series

Notes:

1. Uses “PB” Package in place of “FN” package. Also available mounted on the “K” adapter card.

2. Tekmos “PU” footprint is 0.6mm shorter than “FU” footprint.

3. Packages are RoHS.

4. 3 MHz speed grade replaces 2 MHz speed grade.

5. FS package is replaced by PB package. Tekmos parts are Flash, and can be erased electrically.

6. E1 device replaces E0 device.

7. Flash device replaces ROM device.

General Description

Tekmos manufactures replacements for the popular 68HC11 series of microcontrollers. We cover the A, D, E, F, and K series. Within each series, we provide ROMless and Flash versions. These replacements are functional replacements for the original parts. However, there are some differences, particularly in the packaging options.

Packaging – RoHS

All parts from Tekmos are RoHS compatible. This is equivalent to the “E” suffix in the original series.

Speed Grades

The original series offered parts whose maximum speed ranged from 1 MHz to 3 or 4 MHz. The Tekmos parts are manufactured on a much newer technology, and all Tekmos parts work at the maximum speed.

Temperature Grades

The Tekmos parts are designed to operate over the “M” grade, and can be tested to insure compliance. This may involve a longer leadtime.

Tape and Reel

The R suffix is used to indicate Tape & Reel packaging. Otherwise, PLCC and PDIP devices are shipped in plastic tubes, and LQFP devices are shipped in JEDEC trays.

68HC711 Series

Tekmos parts use Flash instead of the OTP EPROM that was used in the original series. The Tekmos parts are reprogrammable, but require a different programming algorithm.

Significant Package Differences

Packaging – FN-52 (PLCC-52)

The 52 pin PLCC package is obsolete. Tekmos offers two alternatives.

First, we offer the same parts in a 52 pin LQFP package, which is the “PB” package in the original series. The LQFP footprint fits within the original PLCC footprint for easy board modification.

Tekmos also offers an adapter card that holds the 52 pin LQFP package and will mount on a 52 pin PLCC footprint.

Packaging – FU-64 and FU-80

These packages are also obsolete. Tekmos offers product in a LQFP package that is physically the same size, but whose leads do not extend as far from the package (footprint). This package is referred to with the code “PU”

The FU package has leads that extend a nominal 1.3 mm from the side (2.6 mm footprint). The Tekmos part has leads that extend a nominal 1.0 mm from the side (2.0 mm footprint).

The FU package is 14 x 14 x 2.2 mm. The Tekmos package “PU” is 14 x 14 x 1.4 mm.

TK68HC11 F Series

Notes:

1. Packages are RoHS.

2. 4 MHz speed grade replaces 2 MHz and 3 MHz speed grades.

General Description

Tekmos manufactures replacements for the popular 68HC11 series of microcontrollers. We cover the A, D, E, F, and K series. Within each series, we provide ROMless and Flash versions. These replacements are functional replacements for the original parts. However, there are some differences, particularly in the packaging options.

Packaging – RoHS

All parts from Tekmos are RoHS compatible. This is equivalent to the “E” suffix in the original series.

Speed Grades

The original series offered parts whose maximum speed ranged from 1 MHz to 3 or 4 MHz. The Tekmos parts are manufactured on a much newer technology, and all Tekmos parts work at the maximum speed.

Temperature Grades

The Tekmos parts are designed to operate over the “M” grade, and can be tested to insure compliance. This may involve a longer leadtime.

Tape and Reel

The R suffix is used to indicate Tape & Reel packaging. Otherwise, PLCC and PDIP devices are shipped in plastic tubes, and LQFP devices are shipped in JEDEC trays.

68HC711 Series

Tekmos parts use Flash instead of the OTP EPROM that was used in the original series. The Tekmos parts are reprogrammable, but require a different programming algorithm.

Significant Package Differences

Packaging – FN-52 (PLCC-52)

The 52 pin PLCC package is obsolete. Tekmos offers two alternatives.

First, we offer the same parts in a 52 pin LQFP package, which is the “PB” package in the original series. The LQFP footprint fits within the original PLCC footprint for easy board modification.

Tekmos also offers an adapter card that holds the 52 pin LQFP package and will mount on a 52 pin PLCC footprint.

Packaging – FU-64 and FU-80

These packages are also obsolete. Tekmos offers product in a LQFP package that is physically the same size, but whose leads do not extend as far from the package (footprint). This package is referred to with the code “PU”

The FU package has leads that extend a nominal 1.3 mm from the side (2.6 mm footprint). The Tekmos part has leads that extend a nominal 1.0 mm from the side (2.0 mm footprint).

The FU package is 14 x 14 x 2.2 mm. The Tekmos package “PU” is 14 x 14 x 1.4 mm.

TK68HC11 K Series

Notes:

1. Packages are RoHS.

2. 4 MHz speed grade replaces 2 MHz and 3 MHz speed grades.

3. Flash device replaces ROM device.

4. K1 device replaces K0 device.

5. PU package replaces FU package.